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A novel spatially configurable differential interface for an electronic system prototyping platform., , , и . Integr., (2016)A configurable analog buffer dedicated to a wafer-scale prototyping platform of electronic systems., , и . LASCAS, стр. 1-4. IEEE, (2013)A multi-measurements RO-TDC implemented in a Xilinx field programmable gate array., , и . ISCAS, стр. 1-4. IEEE, (2017)Software rendering methods to display wafer scale integrated circuit dataset., , и . CCECE, стр. 1-4. IEEE, (2013)Acceleration of the Secure Hash Algorithm-256 (SHA-256) on an FPGA-CPU Cluster Using OpenCL., , и . ISCAS, стр. 1-5. IEEE, (2021)Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit., , , , , , , и . ICECS, стр. 315-318. IEEE, (2010)Digital signal propagation on a wafer-scale smart active programmable interconnect., , , , и . ICECS, стр. 1059-1062. IEEE, (2008)Propagating analog signals through a fully digital network on an electronic system prototyping platform., , , и . ISCAS, стр. 1983-1986. IEEE, (2012)Multi-Phase Hybrid Boost Converter with High Conduction Loss Reduction and Fast Dynamic Response for Automotive Applications., , , и . NEWCAS, стр. 183-187. IEEE, (2022)A 3.3 V 0.1-1 A Hybrid Buck-Boost Converter with 85-97 % Power Efficiency Range Highly-Suited for Battery-Powered Devices using Low-Profile High-DCR Inductor., , , и . NEWCAS, стр. 303-307. IEEE, (2022)