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Thermal-aware 3D design for side-channel information leakage.

, , , , and . ICCD, page 520-527. IEEE Computer Society, (2016)

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Thermal-aware 3D design for side-channel information leakage., , , , and . ICCD, page 520-527. IEEE Computer Society, (2016)Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space., , , , and . ISVLSI, page 637-642. IEEE Computer Society, (2016)Architectural evaluations on TSV redundancy for reliability enhancement., , , and . DATE, page 566-571. IEEE, (2017)Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5D/3D integration., , , , and . ICCAD, page 56. ACM, (2016)Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges., , , , , , and . ACM Great Lakes Symposium on VLSI, page 347-352. ACM, (2016)Temporal Network Analysis of Email Communication Patterns in a Long Standing Hierarchy., , , , , , , and . CoRR, (2023)Temporal Network Analysis of Email Communication Patterns in a Long Standing Hierarchy., , , , , , , and . ICWSM, page 126-138. AAAI Press, (2024)Routing by matching on convex pieces of grid graphs., , , , , , and . CoRR, (2021)Multiprocessor Architecture for Implementing Adaptive Digital Filters., and . ICC, page 180-185. IEEE, (1986)Raphtory: The temporal graph engine for Rust and Python., , , , , , , , , and 8 other author(s). J. Open Source Softw., 9 (96): 5940 (April 2024)