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Thermal-aware 3D design for side-channel information leakage.

, , , , and . ICCD, page 520-527. IEEE Computer Society, (2016)

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Hotspot monitoring and Temperature Estimation with miniature on-chip temperature sensors., , , , and . ISLPED, page 1-6. IEEE, (2017)Power-efficient, reliable microprocessor architectures: modeling and design methods., , , , , , , , , and 5 other author(s). ACM Great Lakes Symposium on VLSI, page 299-304. ACM, (2010)Thermomechanical stress-aware management for 3D IC designs., , , and . DATE, page 1255-1258. EDA Consortium San Jose, CA, USA / ACM DL, (2013)Energy-Aware Accounting and Billing in Large-Scale Computing Facilities., , , , , , , and . IEEE Micro, 31 (3): 60-71 (2011)Early evaluation techniques for low power binding., , , and . ISLPED, page 160-165. ACM, (2002)Compact and voltage-scalable sensor for accurate thermal sensing in dynamic thermal management., , , , , , and . MWSCAS, page 33-36. IEEE, (2017)Security Threats and Countermeasures in Three-Dimensional Integrated Circuits., , , , , and . ACM Great Lakes Symposium on VLSI, page 321-326. ACM, (2017)An Evaluation of Deeply Decoupled Cores., , , , and . J. Instruction-Level Parallelism, (2006)Low-Overhead Core Swapping for Thermal Management., , , , and . PACS, volume 3471 of Lecture Notes in Computer Science, page 46-60. Springer, (2004)3D stacking of high-performance processors., , , , , , , , , and . HPCA, page 500-511. IEEE Computer Society, (2014)