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7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate.

J. Ahn, K. Lee, Y. Kim, H. Jeong, B. Kim, H. Kim, J. Park, T. Jung, W. Park, T. Lee, E. Park, S. Choi, G. Choi, H. Park, Y. Choi, S. Lee, Y. Kim, Y. Jung, D. Park, S. Nah, Y. Oh, M. Kim, Y. Lee, Y. Chung, I. Hisanori, J. Im, D. Lee, B. Yim, G. Lee, H. Kown, S. Choi, J. Lee, D. Jang, Y. Kim, T. Kim, H. Goto, C. Choi, D. Lee, and G. soo Han. ISSCC, page 124-125. IEEE, (2014)

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Ky ng Kim

Die Artikelstruktur in passiven zweisprachigen Wörterbüchern Deutsch-Koreanisch: Konzeption zur Erstellung eines zweisprachigen Lernerwörterbuchs Deutsch-KoreanischK. Kim. Uni Heidelberg, (2008)

Yongkyu Kim

Bongcheol Kim

Kim Gerber

Youngsang Kim

Other publications of authors with the same name

A 1/2.33-inch 14.6M 1.4μm-pixel backside-illuminated CMOS image sensor with floating diffusion boosting.S. Lee, K. Lee, J. Park, H. Han, Y. Park, T. Jung, Y. Jang, B. Kim, Y. Kim, S. Hamami and 7 other author(s). ISSCC, page 416-418. IEEE, (2011)Advanced novel optical stack technologies for high SNR in CMOS Image Sensor.H. Park, Y. Lee, J. Park, H. Song, T. Lee, H. Gweon, Y. Jung, J. Bae, B. Kim, J. Han and 11 other author(s). VLSI Technology and Circuits, page 353-354. IEEE, (2022)7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate.J. Ahn, K. Lee, Y. Kim, H. Jeong, B. Kim, H. Kim, J. Park, T. Jung, W. Park, T. Lee and 29 other author(s). ISSCC, page 124-125. IEEE, (2014)Development of Advanced Inter-Color-Filter Grid on Sub-Micron-Pixel CMOS Image Sensor for Mobile Cameras with High Sensitivity and High Resolution.I. Joe, Y. Lee, H. Park, J. Kim, D. Kang, T. Kim, M. Kim, K. Lee, M. Heo, I. Ro and 21 other author(s). VLSI Circuits, page 1-2. IEEE, (2021)1/2-inch 7.2MPixel CMOS Image Sensor with 2.25µm Pixels Using 4-Shared Pixel Structure for Pixel-Level Summation.Y. Kim, Y. Kim, S. Choi, H. Kong, S. Hwang, J. Ko, B. Kim, T. Asaba, S. Lim, J. Hahn and 8 other author(s). ISSCC, page 1994-2003. IEEE, (2006)All-Directional Dual Pixel Auto Focus Technology in CMOS Image Sensors.E. Shim, K. Lee, J. Pyo, W. Choi, J. Yun, T. Jung, K. Lee, S. Kim, C. Lee, S. Baek and 9 other author(s). VLSI Circuits, page 1-2. IEEE, (2021)A 1/2.8-inch 24Mpixel CMOS image sensor with 0.9μm unit pixels separated by full-depth deep-trench isolation.Y. Kim, W. Choi, D. Park, H. Jeoung, B. Kim, Y. Oh, S. Oh, B. Park, E. Kim, Y. Lee and 10 other author(s). ISSCC, page 84-86. IEEE, (2018)A Secure, Fast, and Resource-Efficient Serverless Platform with Function REWIND.J. Song, B. Kim, M. Kwak, B. Lee, E. Seo, and J. Jeong. USENIX ATC, page 597-613. USENIX Association, (2024)

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Disambiguation of "Kim, Bumsuk"

Please choose a person to relate this publication to

Ky ng Kim

Yongkyu Kim

Bongcheol Kim

Kim Gerber

Youngsang Kim

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Kim, Bumsuk"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML 7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate.

Please choose a person to relate this publication to

Ky ng Kim

Yongkyu Kim

Bongcheol Kim

Kim Gerber

Youngsang Kim

Other publications of authors with the same name

Disambiguation