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7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate.

J. Ahn, K. Lee, Y. Kim, H. Jeong, B. Kim, H. Kim, J. Park, T. Jung, W. Park, T. Lee, E. Park, S. Choi, G. Choi, H. Park, Y. Choi, S. Lee, Y. Kim, Y. Jung, D. Park, S. Nah, Y. Oh, M. Kim, Y. Lee, Y. Chung, I. Hisanori, J. Im, D. Lee, B. Yim, G. Lee, H. Kown, S. Choi, J. Lee, D. Jang, Y. Kim, T. Kim, H. Goto, C. Choi, D. Lee, и G. soo Han. ISSCC, стр. 124-125. IEEE, (2014)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

Ky ng Kim

Die Artikelstruktur in passiven zweisprachigen Wörterbüchern Deutsch-Koreanisch: Konzeption zur Erstellung eines zweisprachigen Lernerwörterbuchs Deutsch-KoreanischK. Kim. Uni Heidelberg, (2008)

Kison Kim

Sunghun Kim

Yongkyu Kim

Taekwan Kim

Другие публикации лиц с тем же именем

7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate.J. Ahn, K. Lee, Y. Kim, H. Jeong, B. Kim, H. Kim, J. Park, T. Jung, W. Park, T. Lee и 29 other автор(ы). ISSCC, стр. 124-125. IEEE, (2014)Development of Advanced Inter-Color-Filter Grid on Sub-Micron-Pixel CMOS Image Sensor for Mobile Cameras with High Sensitivity and High Resolution.I. Joe, Y. Lee, H. Park, J. Kim, D. Kang, T. Kim, M. Kim, K. Lee, M. Heo, I. Ro и 21 other автор(ы). VLSI Circuits, стр. 1-2. IEEE, (2021)Advanced novel optical stack technologies for high SNR in CMOS Image Sensor.H. Park, Y. Lee, J. Park, H. Song, T. Lee, H. Gweon, Y. Jung, J. Bae, B. Kim, J. Han и 11 other автор(ы). VLSI Technology and Circuits, стр. 353-354. IEEE, (2022)A 1/2.33-inch 14.6M 1.4μm-pixel backside-illuminated CMOS image sensor with floating diffusion boosting.S. Lee, K. Lee, J. Park, H. Han, Y. Park, T. Jung, Y. Jang, B. Kim, Y. Kim, S. Hamami и 7 other автор(ы). ISSCC, стр. 416-418. IEEE, (2011)All-Directional Dual Pixel Auto Focus Technology in CMOS Image Sensors.E. Shim, K. Lee, J. Pyo, W. Choi, J. Yun, T. Jung, K. Lee, S. Kim, C. Lee, S. Baek и 9 other автор(ы). VLSI Circuits, стр. 1-2. IEEE, (2021)1/2-inch 7.2MPixel CMOS Image Sensor with 2.25µm Pixels Using 4-Shared Pixel Structure for Pixel-Level Summation.Y. Kim, Y. Kim, S. Choi, H. Kong, S. Hwang, J. Ko, B. Kim, T. Asaba, S. Lim, J. Hahn и 8 other автор(ы). ISSCC, стр. 1994-2003. IEEE, (2006)A Secure, Fast, and Resource-Efficient Serverless Platform with Function REWIND.J. Song, B. Kim, M. Kwak, B. Lee, E. Seo, и J. Jeong. USENIX ATC, стр. 597-613. USENIX Association, (2024)A 1/2.8-inch 24Mpixel CMOS image sensor with 0.9μm unit pixels separated by full-depth deep-trench isolation.Y. Kim, W. Choi, D. Park, H. Jeoung, B. Kim, Y. Oh, S. Oh, B. Park, E. Kim, Y. Lee и 10 other автор(ы). ISSCC, стр. 84-86. IEEE, (2018)

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Please choose a person to relate this publication to

Ky ng Kim

Kison Kim

Sunghun Kim

Yongkyu Kim

Taekwan Kim

Другие публикации лиц с тем же именем

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