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Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System.

, , и . 3DIC, стр. 1-4. IEEE, (2019)

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Yo Fukushima

 

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Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI., , и . 3DIC, стр. 1-5. IEEE, (2019)Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip., , , , , , , , , и . BioCAS, стр. 519-523. IEEE, (2022)Three-dimensional integration technology and integrated systems., , и . ASP-DAC, стр. 409-415. IEEE, (2009)A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor., , , , , , и . 3DIC, стр. 1-4. IEEE, (2013)Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV., , , , , , , , и . 3DIC, стр. 1-4. IEEE, (2013)Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory., , , , , , , и . 3DIC, стр. 1-4. IEEE, (2013)Temporary bonding strength control for self-assembly-based 3D integration., , , , , , и . 3DIC, стр. 1-4. IEEE, (2011)A very low area ADC for 3-D stacked CMOS image processing system., , , , , , и . 3DIC, стр. 1-4. IEEE, (2011)An empirical study of just-in-time defect prediction using cross-project models., , , , и . MSR, стр. 172-181. ACM, (2014)High-bandwidth data transmission of new transceiver module through optical interconnection., , , , , и . 3DIC, стр. 1-4. IEEE, (2011)