( en | de | ru )

 

Disambiguation of "Saraza-Canflanca, Pablo"

Author of the publication

copydeleteadd this publication to your clipboard
Improving the Tamper-Aware Odometer Concept by Enhancing Dynamic Stress Operation.

, , , , , and . IRPS, page 1-9. IEEE, (2023)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Pablo Robert

Pablo Zamora

Pablo Hess

Pablo Meissner

Pablo Berger

 

Other publications of authors with the same name

A Model Parameter Extraction Methodology Including Time-Dependent Variability for Circuit Reliability Simulation., , , , , , , , and . SMACD, page 53-56. IEEE, (2018)Automated Massive RTN Characterization Using a Transistor Array Chip., , , , , , , , and . SMACD, page 29-32. IEEE, (2018)A Ring-Oscillator-Based Degradation Monitor Concept with Tamper Detection Capability., , , , , and . IRPS, page 1-7. IEEE, (2022)New method for the automated massive characterization of Bias Temperature Instability in CMOS transistors., , , , , , , and . DATE, page 150-155. IEEE, (2019)TiDeVa: A Toolbox for the Automated and Robust Analysis of Time-Dependent Variability at Transistor Level., , , , , , , and . SMACD, page 197-200. IEEE, (2019)Improving the reliability of SRAM-based PUFs in the presence of aging., , , , , and . DTIS, page 1-6. IEEE, (2020)A detailed, cell-by-cell look into the effects of aging on an SRAM PUF using a specialized test array., , , , , and . SMACD, page 1-4. IEEE, (2023)Exploiting Bias Temperature Instability for Reservoir Computing in Edge Artificial Intelligence Applications., , , , , , , and . IRPS, page 1-7. IEEE, (2024)Statistical Characterization of Off-State Stress Degradation in Planar HKMG nFETs Using Device Arrays., , , , , , and . IRPS, page 8. IEEE, (2024)Using dedicated device arrays for the characterization of TDDB in a scaled HK/MG technology., , , , , and . IRPS, page 1-6. IEEE, (2023)