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Disambiguation of "Vandevelde, Bart"

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Fine grain thermal modeling and experimental validation of 3D-ICs.

, , , , , , , , , and . Microelectron. J., 42 (4): 572-578 (2011)

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Bart Cramer

Bart Maris

Bart Kersbergen

Bart Geurts

Bart Riel

 

Other publications of authors with the same name

Modeling and Control of Electrowetting Induced Droplet Motion., , and . Micromachines, 3 (1): 150-167 (2012)3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps., , , , , , , , , and 9 other author(s). ICICDT, page 1-4. IEEE, (2012)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology., , , , , , , , , and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)Design and implementation of flexible and stretchable systems., , , , , , , , and . Microelectron. Reliab., 51 (6): 1069-1076 (2011)Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components., , , , , , , , , and . Microelectron. Reliab., (2017)Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems., , and . Microelectron. Reliab., 47 (2-3): 159-160 (2007)Fine grain thermal modeling and experimental validation of 3D-ICs., , , , , , , , , and . Microelectron. J., 42 (4): 572-578 (2011)Impact of oxide liner properties on TSV Cu pumping and TSV stress., , , , , , , , , and 2 other author(s). IRPS, page 4. IEEE, (2015)Analysis of microbump induced stress effects in 3D stacked IC technologies., , , , , , , , , and 9 other author(s). 3DIC, page 1-5. IEEE, (2011)Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly., , , , and . Microelectron. Reliab., 47 (2-3): 215-222 (2007)