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Thermal experimental and modeling analysis of high power 3D packages., , , , , and . ICICDT, page 1-4. IEEE, (2015)Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions., , , , , , , , , and 8 other author(s). CICC, page 1-4. IEEE, (2010)Design issues and considerations for low-cost 3D TSV IC technology., , , , , , , , , and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation., , , , , , , , , and 7 other author(s). IRPS, page 1-6. IEEE, (2024)Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications., , , , , , , , and . IRPS, page 1-4. IEEE, (2019)Fine grain thermal modeling and experimental validation of 3D-ICs., , , , , , , , , and . Microelectron. J., 42 (4): 572-578 (2011)New fast distributed thermal model for analysis of GaN based power devices., , , , , and . ESSDERC, page 172-175. IEEE, (2016)Modeling and Control of Electrowetting Induced Droplet Motion., , and . Micromachines, 3 (1): 150-167 (2012)Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator., , , , , and . PSC, page 1-3. IEEE, (2023)