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Logic-on-logic 3D integration and placement., , , и . 3DIC, стр. 1-4. IEEE, (2010)Throughput optimization for streaming applications on CPU-FPGA heterogeneous systems., , , , и . ASP-DAC, стр. 488-493. IEEE, (2017)LP based white space redistribution for thermal via planning and performance optimization in 3D ICs., , , , и . ASP-DAC, стр. 209-212. IEEE, (2008)A robust detailed placement for mixed-size IC designs., и . ASP-DAC, стр. 188-194. IEEE, (2006)A scalable communication-aware compilation flow for programmable accelerators., , и . ASP-DAC, стр. 503-510. IEEE, (2016)A fast multilayer general area router for MCM designs., и . EURO-DAC, стр. 292-297. IEEE Computer Society Press, (1992)Are we ready for system-level synthesis?, , , , , , , и . ASP-DAC, ACM Press, (2005)Optimal module and voltage assignment for low-power., , и . ASP-DAC, стр. 850-855. ACM Press, (2005)Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs., , , , , и . ASP-DAC, стр. 261-266. IEEE, (2011)Designing scratchpad memory architecture with emerging STT-RAM memory technologies., , , , и . ISCAS, стр. 1244-1247. IEEE, (2013)