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Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps., , , , , , , , and . IRPS, page 1-6. IEEE, (2021)Assessment of critical Co electromigration parameters., , , , , , , , and . IRPS, page 8. IEEE, (2022)TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes., , , , , , , , , and 2 other author(s). DAC, page 24:1-24:6. ACM, (2013)BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure., , , , , , , and . IRPS, page 1-7. IEEE, (2024)Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill., , , , , , , , , and . IRPS, page 1-6. IEEE, (2020)Insights into metal drift induced failure in MOL and BEOL., , , , , , and . IRPS, page 3. IEEE, (2018)Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper., , , , , , , , , and 3 other author(s). ICICDT, page 1-4. IEEE, (2021)Novel Low Thermal Budget CMOS RMG: Performance and Reliability Benchmark Against Conventional High Thermal Budget Gate Stack Solutions., , , , , , , , and . VLSI Technology and Circuits, page 1-2. IEEE, (2023)Statistical aspects of the degradation of LDD nMOSFETs., , , , , , , , and . Microelectron. Reliab., 42 (9-11): 1409-1413 (2002)Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects., , , , , and . IRPS, page 1-6. IEEE, (2019)