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Disambiguation of "Thieu, Gia Bao"

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Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology

, , , , , , and . Applied Reconfigurable Computing. Architectures, Tools, and Applications, page 357--360. Cham, Springer Nature Switzerland, (2023)

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Gia Anh Bao Phan

Vinh An Thieu-Simchen

Jin Bao

Wenwen Bao

Gia Toussaint

 

Other publications of authors with the same name

A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure, , , , , and . 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), page 1-5. (April 2023)ZuSE KI-AVF, , , , , , , , , and 18 other author(s). (2023)Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology, , , , , , and . Applied Reconfigurable Computing. Architectures, Tools, and Applications, page 357--360. Cham, Springer Nature Switzerland, (2023)N2V2PRO: Neural Network Mapping Framework for a Custom Vector Processor Architecture, , , , , , , and . 2023 IEEE 13th International Conference on Consumer Electronics - Berlin (ICCE-Berlin), page 94-99. (September 2023)ZuSE Ki-Avf: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous Driving., , , , , , , , , and 18 other author(s). DATE, page 1-6. IEEE, (2023)TAPRE-HBM: Trace-Based Processor Rapid Emulation Using HBM on FPGAs, , , , , , and . Applied Reconfigurable Computing. Architectures, Tools, and Applications, page 307--321. Cham, Springer Nature Switzerland, (2023)Multi-Level Prototyping of a Vertical Vector AI Processing System., , , , , and . ASAP, page 1-2. IEEE, (2024)ZuSE Ki-Avf: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous Driving, , , , , , , , , and 18 other author(s). 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), page 1-6. (April 2023)N2V2PRO, , , , , , , and . (2023)Characterization of Soft Errors on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure, , , , , , , and . 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), page 1-5. (April 2024)