( en | de | ru )

 

Disambiguation of "Stan, Mircea R."

Author of the publication

copydeleteadd this publication to your clipboard
A cross-layer design exploration of charge-recycled power-delivery in many-layer 3d-IC.

, , , , , and . DAC, page 133:1-133:6. ACM, (2015)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Mircea R ducanu

Mircea R ducanu

Constantin Stan

Cornel Stan

Johann Stan

 

Other publications of authors with the same name

A new taxonomy for reconfigurable prefix adders., and . ISCAS, page 1227-1230. IEEE, (2012)Graphene Devices, Interconnect and Circuits - Challenges and Opportunities., , , and . ISCAS, page 69-72. IEEE, (2009)A post-silicon hold time closure technique using data-path tunable-buffers for variation-tolerance in sub-threshold designs., , , , and . ISQED, page 341-346. IEEE, (2018)Stacking SRAM banks for ultra low power standby mode operation., , and . DAC, page 699-704. ACM, (2010)Walking Pads: Managing C4 Placement for Transient Voltage Noise Minimization., , , , and . DAC, page 126:1-126:6. ACM, (2014)Improving SRAM Vmin and yield by using variation-aware BTI stress., , , , , and . CICC, page 1-4. IEEE, (2010)Analog VLSI for robot path planning., , , and . J. VLSI Signal Process., 8 (1): 61-73 (1994)Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model., , , , and . IEEE Trans. Computers, 57 (9): 1277-1288 (2008)Using Intradisk Parallelism to Build Energy-Efficient Storage Systems., , and . IEEE Micro, 29 (1): 50-61 (2009)A Case for Thermal-Aware Floorplanning at the Microarchitectural Level., , , and . J. Instruction-Level Parallelism, (2005)