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Quality Driven Systematic Approximation for Binary-Weight Neural Network Deployment.

Y. Gong, H. Cai, H. Wu, W. Ge, H. Yan, Z. Wang, L. Shi, и B. Liu. IEEE Trans. Circuits Syst. I Regul. Pap., 69 (7): 2928-2940 (2022)

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Huili Shi

Lei Shi

Zhanjun Shi

Jian Shi

Renhu Shi

Другие публикации лиц с тем же именем

Low power design for SoC with power management unit.D. Sun, S. Xu, W. Sun, S. Lu, и L. Shi. ASICON, стр. 719-722. IEEE, (2011)A 65nm 10MHz single-inductor dual-output switching buck converter with time-multiplexing control.M. Yang, W. Sun, S. Xu, S. Lu, и L. Shi. ASICON, стр. 870-873. IEEE, (2011)A Data Prefetch and Reuse Strategy for Coarse-Grained Reconfigurable Architectures.W. Ge, Z. Qi, Y. Du, L. Ma, и L. Shi. IEICE Trans. Inf. Syst., 96-D (3): 616-623 (2013)An Analytical Model for Domain-Specific Accelerator Deploying Sparse LU Factorization.S. Huang, J. Sha, и L. Shi. ASICON, стр. 1-4. IEEE, (2023)14.1 A 510nW 0.41V Low-Memory Low-Computation Keyword-Spotting Chip Using Serial FFT-Based MFCC and Binarized Depthwise Separable Convolutional Neural Network in 28nm CMOS.W. Shan, M. Yang, J. Xu, Y. Lu, S. Zhang, T. Wang, J. Yang, L. Shi, и M. Seok. ISSCC, стр. 230-232. IEEE, (2020)Domain Strategy and Coverage Metric for Validation.C. Luo, J. Yang, L. Shi, X. Wu, и Y. Zhang. ISQED, стр. 40-45. IEEE Computer Society, (2005)A Graph-Learning-Driven Prediction Method for Combined Electromigration and Thermomigration Stress on Multi-Segment Interconnects.Y. Zuo, Y. Ye, H. Zhang, T. Chen, H. Yan, и L. Shi. DATE, стр. 1-6. IEEE, (2024)Meta-Model based High-Dimensional Yield Analysis using Low-Rank Tensor Approximation.X. Shi, H. Yan, Q. Huang, J. Zhang, L. Shi, и L. He. DAC, стр. 150. ACM, (2019)TS Cache: A Fast Cache with Timing-speculation Mechanism Under Low Supply Voltages.S. Shen, T. Shao, X. Shang, Y. Guo, M. Ling, J. Yang, и L. Shi. CoRR, (2019)A novel surface potential-based short channel MOSFET model for circuit simulation.K. Jia, W. Sun, и L. Shi. Microelectron. J., 42 (10): 1169-1175 (2011)

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