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Disambiguation of "Chakrabarty, Krishnendu"

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Hardware-Supported Patching of Security Bugs in Hardware IP Blocks.

, , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (1): 54-67 (2023)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Krishnendu Mukherjee

Koushik Chakrabarty

Arnab Chakrabarty

Sayan Chakrabarty

Shyamal Chakrabarty

 

Other publications of authors with the same name

Mathematical Modeling of Intellectual Property Protection Using Partially-Mergeable Cores., , , and . PDPTA, CSREA Press, (2000)Multi-site test optimization for multi-Vdd SoCs using space- and time- division multiplexing., , , , and . DATE, page 1-6. European Design and Automation Association, (2014)Wrapper/TAM co-optimization, constraint-driven test scheduling, and tester data volume reduction for SOCs., , and . DAC, page 685-690. ACM, (2002)Synterface: Efficient Chip-to-World Interfacing for Flow-Based Microfluidic Biochips Using Pin-Count Minimization., , and . ACM Trans. Embed. Comput. Syst., 18 (5s): 54:1-54:21 (2019)Control-Logic Synthesis of Fully Programmable Valve Array Using Reinforcement Learning., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 43 (1): 277-290 (January 2024)Formal Synthesis of Adaptive Droplet Routing for MEDA Biochips., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 41 (8): 2504-2517 (2022)Cross-Contamination Avoidance for Droplet Routing in Digital Microfluidic Biochips., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 31 (6): 817-830 (2012)Energy-conscious, deterministic I/O device scheduling in hard real-time systems., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 22 (7): 847-858 (2003)Test Wrapper Design and Optimization Under Power Constraints for Embedded Cores With Multiple Clock Domains., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 26 (8): 1539-1547 (2007)Contactless Pre-Bond TSV Test and Diagnosis Using Ring Oscillators and Multiple Voltage Levels., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 33 (5): 774-785 (2014)