( en | de | ru )

 

Disambiguation of "Lacord, Joris"

Author of the publication

copydeleteadd this publication to your clipboard
The importance of the spacer region to explain short channels mobility collapse in 28nm Bulk and FDSOI technologies.

, , , , , , , , and . ESSDERC, page 254-257. IEEE, (2014)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Urban Jörissen

Jörg-Udo Joris

Joris Vorstius

Joris Corvo

Joris Guerry

 

Other publications of authors with the same name

Impact of spacer interface charges on performance and reliability of low temperature transistors for 3D sequential integration., , , , , , , , , and 2 other author(s). IRPS, page 1-5. IEEE, (2021)Analytical modeling of parasitics in monolithically integrated 3D inverters., , , and . ICICDT, page 1-4. IEEE, (2012)From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose., , , , , , , , and . 3DIC, page 1-5. IEEE, (2016)Ultra-High-density 3D vertical RRAM with stacked JunctionLess nanowires for In-Memory-Computing applications., , , , , , , , and . CoRR, (2020)Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration., , , , , , , , , and 8 other author(s). VLSI Technology and Circuits, page 332-333. IEEE, (2022)A novel 3D 1T1R RRAM architecture for memory-centric Hyperdimensional Computing., , , , , , , , , and . IMW, page 1-4. IEEE, (2022)Impact of intermediate BEOL technology on standard cell performances of 3D VLSI., , , , , , , , , and 3 other author(s). ESSDERC, page 218-221. IEEE, (2016)The importance of the spacer region to explain short channels mobility collapse in 28nm Bulk and FDSOI technologies., , , , , , , , and . ESSDERC, page 254-257. IEEE, (2014)