Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

On Closing the Gap Between Pre-Simulation and Post-Simulation Results in Nanometer Analog Layouts.

P. Pan, H. Huang, C. Huang, A. Patyal, H. Chen, and T. Yang. SMACD, page 181-184. IEEE, (2018)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Ming Chen

Other publications of authors with the same name

Striking the Balance between Content Diversity and Content Importance in Swarm-Based P2P Streaming System.C. Chang, C. Chou, and M. Chen. HPCC, page 653-660. IEEE, (2011)More Effective Power Network Prototyping by Analytical and Centroid Learning.Y. Chuang, C. Lin, H. Chen, C. Lee, and T. Chen. ISCAS, page 1-5. IEEE, (2019)A Structure-Based Methodology for Analog Layout Generation.Y. Chen, H. Chi, L. Song, C. Liu, and H. Chen. SMACD, page 33-36. IEEE, (2019)A network-flow based algorithm for power density mitigation at post-placement stage.S. Liu, R. Luo, and H. Chen. DATE, page 1707-1710. EDA Consortium San Jose, CA, USA / ACM DL, (2013)PAGE: parallel agile genetic exploration towards utmost performance for analog circuit design.P. Pan, H. Chen, and C. Lin. DATE, page 1849-1854. EDA Consortium San Jose, CA, USA / ACM DL, (2013)Routability-driven bump assignment for chip-package co-design.M. Chen, T. Tsai, H. Chen, and S. Chen. ASP-DAC, page 519-524. IEEE, (2014)Multi-level droplet routing in active-matrix based digital-microfluidic biochips.G. Lu, B. Bhattacharya, T. Ho, and H. Chen. ASP-DAC, page 46-51. IEEE, (2018)Solving Large Knowledge Base Partitioning Problems Using an Intelligent Genetic AlgorithmS. Ho, H. Chen, and L. Shu. Proceedings of the Genetic and Evolutionary Computation Conference, 2, page 1567--1572. Orlando, Florida, USA, Morgan Kaufmann, (13-17 July 1999)Design Planning with 3D-Via Optimization in Alternative Stacking Integrated Circuits.C. Lu, H. Chen, and C. Liu. J. Inf. Sci. Eng., 27 (1): 287-302 (2011)Mixed non-rectangular block packing for non-Manhattan layout architectures.M. Wu, H. Chen, and J. Jou. ISQED, page 257-262. IEEE, (2011)

BibSonomy

Disambiguation of "Chen, Hung-Ming"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

On Closing the Gap Between Pre-Simulation and Post-Simulation Results in Nanometer Analog Layouts.

Please choose a person to relate this publication to

Ming Chen

Ming Chen

Ming Chen

Ming Chen

Ming Chen

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Chen, Hung-Ming"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML On Closing the Gap Between Pre-Simulation and Post-Simulation Results in Nanometer Analog Layouts.

Please choose a person to relate this publication to

Ming Chen

Ming Chen

Ming Chen

Ming Chen

Ming Chen

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

On Closing the Gap Between Pre-Simulation and Post-Simulation Results in Nanometer Analog Layouts.