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Heterogeneous and Elastic Computation Framework for Mobile Cloud Computing., , , и . Int. J. Softw. Eng. Knowl. Eng., 24 (7): 1013-1038 (2014)Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization., , , , , , и . ICCAD, стр. 1-7. IEEE, (2023)Layout-level Vulnerability Ranking from Electromagnetic Fault Injection., , , , , , , , и . HOST, стр. 17-20. IEEE, (2022)ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs., , , , , , , , и . VLSI-DAT, стр. 1-8. IEEE, (2022)Low-IR-Drop Test Pattern Regeneration Using A Fast Predictor., , , , , , , и . ISQED, стр. 27-32. IEEE, (2022)Applications of Large Language Models in Data Processing: Innovative Approaches to Segmenting and Renewing Information., , , , , , , и . CoRR, (2023)Bad page relaxation to prolong the lifetime of flash devices., , , , , и . GCCE, стр. 715-716. IEEE, (2014)Clocktree RLC Extraction with Efficient Inductance Modeling., , , , и . DATE, стр. 522-526. IEEE Computer Society / ACM, (2000)Power/Ground Integrity Issues for Sub-130nm IC Designs (Tutorial Abstract).. ISQED, стр. 10. IEEE Computer Society, (2002)Quick On-Chip Self- and Mutual-Inductance Screen., , и . ISQED, стр. 513-. IEEE Computer Society, (2000)