Author of the publication

Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects.

, , , , , , , and . IRPS, page 1-6. IEEE, (2019)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Variation-aware Fault Modeling and Test Generation for STT-MRAM., , , , and . IOLTS, page 80-83. IEEE, (2019)Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects., , , , , , , and . IRPS, page 1-5. IEEE, (2020)Dynamic Faults based Hardware Trojan Design in STT-MRAM., , , and . DATE, page 933-938. IEEE, (2020)Defect Characterization and Test Generation for Spintronic-based Compute-In-Memory., , and . ETS, page 1-6. IEEE, (2020)Special Session - Emerging Memristor Based Memory and CIM Architecture: Test, Repair and Yield Analysis., , , , , , , , and . VTS, page 1-10. IEEE, (2020)Mitigating Read Failures in STT-MRAM., , and . VTS, page 1-6. IEEE, (2020)Variation Analysis, Fault Modeling and Yield Improvement of Emerging Spintronic Memories. Karlsruhe University, Germany, (2020)base-search.net (ftubkarlsruhe:oai:EVASTAR-Karlsruhe.de:1000119696).Using multifunctional standardized stack as universal spintronic technology for IoT., , , , , , , , , and 8 other author(s). DATE, page 931-936. IEEE, (2018)VAET-STT: A variation aware estimator tool for STT-MRAM based memories., , , , and . DATE, page 1456-1461. IEEE, (2017)A Universal Spintronic Technology based on Multifunctional Standardized Stack., , , , , , , , and . DATE, page 394-399. IEEE, (2020)