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Bias Temperature Instability (BTI) of High-Voltage Devices for Memory Periphery., , , , , , , , , and 7 other author(s). IRPS, page 1-6. IEEE, (2022)DRAM-Peri FinFET - A Thermally-Stable High-Performance Advanced CMOS RMG Platform with Mo-Based pWFM for sub-10nm DRAM., , , , , , , , , and 6 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2024)Reliability impact of advanced doping techniques for DRAM peripheral MOSFETs., , , , , , , and . ICICDT, page 1-4. IEEE, (2015)Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations., , , , , , , , , and 1 other author(s). IMW, page 1-4. IEEE, (2022)Side and Corner Region Non-Uniformities in Grown SiO2 and Their Implications on Current, Capacitance and Breakdown Characteristics., , , , , , , , , and . IRPS, page 36. IEEE, (2024)Impact of Off State Stress on advanced high-K metal gate NMOSFETs., , , , , , and . ESSDERC, page 365-368. IEEE, (2014)Dedicated technology threshold voltage tuning for 6T SRAM beyond N7., , , , , , , , , and 1 other author(s). ICICDT, page 1-4. IEEE, (2017)I/O thick oxide device integration using Diffusion and Gate Replacement (D&GR) gate stack integration., , , , , , , , , and 2 other author(s). ICICDT, page 1-4. IEEE, (2015)Gate-Stack Engineered NBTI Improvements in Highvoltage Logic-For-Memory High-ĸ/Metal Gate Devices., , , , , , , , , and 6 other author(s). IRPS, page 1-8. IEEE, (2019)Assessment of SiGe quantum well transistors for DRAM peripheral applications., , , , , , , , , and 1 other author(s). ICICDT, page 1-4. IEEE, (2015)