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A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches.

, , , , , , , , , , , and . ESSCIRC, page 318-321. IEEE, (2018)

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2D to 3D Test Pattern Retargeting Using IEEE P1687 Based 3D DFT Architectures., , , , , and . ISVLSI, page 386-391. IEEE Computer Society, (2014)Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes., , , , , , and . 3DIC, page 1-5. IEEE, (2016)Fast and accurate power annotated simulation: Application to a many-core architecture., , , and . PATMOS, page 191-198. IEEE, (2013)3D NoC using through silicon Via: An asynchronous implementation., , , and . VLSI-SoC, page 232-237. IEEE, (2011)An Asynchronous Power Aware and Adaptive NoC Based Circuit., , , , , , , , , and 1 other author(s). IEEE J. Solid State Circuits, 44 (4): 1167-1177 (2009)Reconfigurable tiles of computing-in-memory SRAM architecture for scalable vectorization., , , , , , , and . ISLPED, page 121-126. ACM, (2020)A fully integrated power supply unit for fine grain power management application to embedded Low Voltage SRAMs., , , , , , , , and . ESSCIRC, page 138-141. IEEE, (2008)Advances in asynchronous logic: from principles to GALS & NoC, recent industry applications, and commercial CAD tools., , and . DATE, page 1715-1724. EDA Consortium San Jose, CA, USA / ACM DL, (2013)Thermal analysis and model identification techniques for a logic + WIDEIO stacked DRAM test chip., , , , and . DATE, page 1-4. European Design and Automation Association, (2014)M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC., , , , , , and . DATE, page 1740-1745. IEEE, (2020)