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An integrated floorplanning with an efficient buffer planning algorithm., , , , , , и . ISPD, стр. 136-142. ACM, (2003)Floorplanning with Abutment Constraints and L-Shaped/T-Shaped Blocks based on Corner Block List., , , , , и . DAC, стр. 770-775. ACM, (2001)Novel and efficient min cut based voltage assignment in gate level., , , , , и . ISQED, стр. 150-155. IEEE, (2011)Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs., , , , , и . Integr., 46 (1): 1-9 (2013)LP based white space redistribution for thermal via planning and performance optimization in 3D ICs., , , , и . ASP-DAC, стр. 209-212. IEEE, (2008)Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs., , , , , и . ASP-DAC, стр. 261-266. IEEE, (2011)VLSI floorplanning with boundary constraints based on corner block list., , , , , и . ASP-DAC, стр. 509-514. ACM, (2001)Incremental power optimization for multiple supply voltage design., , , and . ISQED, page 280-286. IEEE Computer Society, (2009)Relation-oriented resource allocation for multi-accelerator systems., , , , , , , , and . ASAP, page 243-244. IEEE Computer Society, (2016)An effective buffer planning algorithm for IP based fixed-outline SOC placement., , , , and . ACM Great Lakes Symposium on VLSI, page 564-569. ACM, (2007)