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3.5-D integration: A case study., , , , и . ISCAS, стр. 2087-2090. IEEE, (2013)Hierarchical Thermal Management Policy for High-Performance 3D Systems With Liquid Cooling., , , и . IEEE J. Emerg. Sel. Topics Circuits Syst., 1 (2): 88-101 (2011)PLEASURE: a computer program for simple/multiple constrained/unconstrained folding of Programmable Logic Arrays., и . DAC, стр. 530-537. ACM/IEEE, (1983)Temperature-aware runtime power management for chip-multiprocessors with 3-D stacked cache., , , и . ISQED, стр. 163-170. IEEE, (2014)Characterization of memristive Poly-Si Nanowires via empirical physical modelling., , , , и . ISCAS, стр. 1675-1678. IEEE, (2010)Design aspects of carry lookahead adders with vertically-stacked nanowire transistors., , , и . ISCAS, стр. 1715-1718. IEEE, (2010)Memristor-based devices for sensing., , , , и . ISCAS, стр. 2257-2260. IEEE, (2014)Kernel-Based Power Optimization of RTL Components: Exact and Approximate Extraction Algorithms., , , , и . DAC, стр. 247-252. ACM Press, (1999)An integrated platform for differential electrochemical and ISFET sensing., , , и . ISCAS, стр. 2875-2878. IEEE, (2016)Automatic Synthesis of Large Telescopic Units Based on Near-Minimum Timed Supersetting., , , , , и . IEEE Trans. Computers, 48 (8): 769-779 (1999)