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Disambiguation of "Tanaka, Yu"

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Design and Characterization of Dispersion-Tailored Silicon Strip Waveguides toward Wideband Wavelength Conversion.

, , , , , , , , , , , and . IEICE Trans. Electron., 106 (11): 757-764 (November 2023)

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Masao Tanaka

Masafumi Tanaka

Shin Tanaka

Shu Tanaka

Mikiko Tanaka

 

Other publications of authors with the same name

70 Gbaud Operation of All-Silicon Mach-Zehnder Modulator based on Forward-Biased PIN Diodes and Passive Equalizer., , , , and . OECC/PSC, page 1-3. IEEE, (2019)38.4-Tbps Inline-amplified Transmission Using PPLN-based Optical Parametric Amplifier over 6 THz within L- and U-bands., , , , , , , , , and 3 other author(s). OFC, page 1-3. IEEE, (2023)Delayed interferometer based Si-wire WDM demultiplexers fabricated by phase controllable and productive 300-mm wafer-scale ArF-immersion lithography technology., , , , , and . OFC, page 1-3. IEEE, (2014)A System for Worldwide COVID-19 Information Aggregation., , , , , , , , , and 19 other author(s). NLP4COVID@EMNLP, Association for Computational Linguistics, (2020)Low crosstalk simultaneous 12 ch × 25 Gb/s operation of high-density silicon photonics multichannel receiver., , , , , , , , , and 6 other author(s). OFC, page 1-3. IEEE, (2017)Low Crosstalk Simultaneous 16-channel × 25 Gb/s Operation of High Density Silicon Photonics Optical Transceiver., , , , , , , , , and 6 other author(s). ECOC, page 1-3. IEEE, (2017)On-Package High-Density Silicon Photonics Optical Transceiver., , , , , , , , , and 6 other author(s). ECOC, page 1-3. IEEE, (2018)U-Band Transmission Characteristics over Standard Cladding Step-Index 4-Core Fiber Span., , , , , , , , , and 2 other author(s). OFC, page 1-3. IEEE, (2024)U-band WDM Transmission over 90-km Deployed Fiberoptic Cable Leveraged by S+C+L-band WDM Channels., , , , , , , , , and 1 other author(s). OFC, page 1-3. IEEE, (2024)WDM Transmission in S-Band Using PPLN-Based Wavelength Converters and 400-Gb/s C-Band Real-Time Transceivers., , , , , , , , , and 1 other author(s). OECC/PSC, page 1-4. IEEE, (2022)