Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.

Y. Ji, J. Kim, J. Kim, M. Lee, J. Noh, T. Jeong, J. Shin, J. Kim, Y. Heo, U. Cho, H. Sagong, J. Park, Y. Choo, G. Do, H. Kang, E. Choi, D. Sun, C. Kang, S. Shin, and S. Pae. IRPS, page 3. IEEE, (2018)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Ky ng Kim

Die Artikelstruktur in passiven zweisprachigen Wörterbüchern Deutsch-Koreanisch: Konzeption zur Erstellung eines zweisprachigen Lernerwörterbuchs Deutsch-KoreanischK. Kim. Uni Heidelberg, (2008)

Ryong Kim

Yongkyu Kim

Bongcheol Kim

Kim Gerber

Other publications of authors with the same name

FlexRound: Learnable Rounding based on Element-wise Division for Post-Training Quantization.J. Lee, J. Kim, S. Kwon, and D. Lee. ICML, volume 202 of Proceedings of Machine Learning Research, page 18913-18939. PMLR, (2023)Improving Multi-hop Logical Reasoning in Knowledge Graphs with Context-Aware Query Representation Learning.J. Kim, H. Jung, H. Jang, and H. Park. CoRR, (2024)Towards a Federated Learning Framework for Heterogeneous Devices of Internet of Things.H. Zhang, and J. Kim. CoRR, (2021)A Hospital-tethered Mobile Personal Health Records: Comparison of Patient Engagement Function Usage Pattern According to Version-up.Y. Lee, Y. Park, J. Lee, J. Kim, J. Kim, and W. Kim. AMIA, AMIA, (2018)Demusa: Demo for Multimodal Sentiment Analysis.S. Hong, J. Kim, D. Lee, and H. Cho. ICME Workshops, page 1. IEEE, (2022)LUT-GEMM: Quantized Matrix Multiplication based on LUTs for Efficient Inference in Large-Scale Generative Language Models.G. Park, B. Park, M. Kim, S. Lee, J. Kim, B. Kwon, S. Kwon, B. Kim, Y. Lee, and D. Lee. ICLR, OpenReview.net, (2024)Rethinking Channel Dimensions to Isolate Outliers for Low-bit Weight Quantization of Large Language Models.J. Heo, J. Kim, B. Kwon, B. Kim, S. Kwon, and D. Lee. ICLR, OpenReview.net, (2024)Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.Y. Ji, J. Kim, J. Kim, M. Lee, J. Noh, T. Jeong, J. Shin, J. Kim, Y. Heo, U. Cho and 10 other author(s). IRPS, page 3. IEEE, (2018)ProFeat: Unsupervised image clustering via progressive feature refinement.J. Kim, S. Im, and S. Cho. Pattern Recognit. Lett., (2022)AlphaTuning: Quantization-Aware Parameter-Efficient Adaptation of Large-Scale Pre-Trained Language Models.S. Kwon, J. Kim, J. Bae, K. Yoo, J. Kim, B. Park, B. Kim, J. Ha, N. Sung, and D. Lee. EMNLP (Findings), page 3288-3305. Association for Computational Linguistics, (2022)

BibSonomy

Disambiguation of "Kim, Jeonghoon"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.

Please choose a person to relate this publication to

Ky ng Kim

Ryong Kim

Yongkyu Kim

Bongcheol Kim

Kim Gerber

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Kim, Jeonghoon"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.

Please choose a person to relate this publication to

Ky ng Kim

Ryong Kim

Yongkyu Kim

Bongcheol Kim

Kim Gerber

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.