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On the parametric failures of SRAM in a 3D-die stack considering tier-to-tier supply cross-talk., , , и . VTS, стр. 264-269. IEEE Computer Society, (2012)A 128b AES Engine with Higher Resistance to Power and Electromagnetic Side-Channel Attacks Enabled by a Security-Aware Integrated All-Digital Low-Dropout Regulator., , , , , и . ISSCC, стр. 404-406. IEEE, (2019)An on-chip autonomous thermoelectric energy management system for energy-efficient active cooling., , и . ISLPED, стр. 51-56. ACM, (2014)Analysis of thermal behaviors of spin-torque-transfer RAM: a simulation study., , , и . ISLPED, стр. 13-18. ACM, (2010)Design of an Energy-Efficient Accelerator for Training of Convolutional Neural Networks using Frequency-Domain Computation., , , и . DAC, стр. 59:1-59:6. ACM, (2017)On the potential of 3D integration of inductive DC-DC converter for high-performance power delivery., , и . DAC, стр. 179:1-179:8. ACM, (2013)Exploring tunnel-FET for ultra low power analog applications: a case study on operational transconductance amplifier., , и . DAC, стр. 109:1-109:6. ACM, (2013)On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking., и . DAC, стр. 27:1-27:6. ACM, (2014)Self-calibration technique for reduction of hold failures in low-power nano-scaled SRAM., , , и . DAC, стр. 971-976. ACM, (2006)FocalNet - Foveal Attention for Post-processing DNN Outputs., и . IJCNN, стр. 1-8. IEEE, (2019)