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2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters., , , , , , , , , and 18 other author(s). ISSCC, page 46-48. IEEE, (2020)An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration., , , , , , , , , and 1 other author(s). Microelectron. J., 46 (2): 153-165 (2015)A Cryogenic Active Router for Qubit Array Biasing from DC to 320 MHz at 100 nm Gate Pitch., , , , , , , , , and 2 other author(s). ESSCIRC, page 157-160. IEEE, (2023)Specificities of linear Si QD arrays integration and characterization., , , , , , , , , and 11 other author(s). VLSI Technology and Circuits, page 415-416. IEEE, (2022)3D integration technology for set-top box application., , , , , , , , , and 1 other author(s). 3DIC, page 1-7. IEEE, (2009)Predicting Word Concreteness and Imagery., and . IWCS (1), page 176-187. Association for Computational Linguistics, (2019)Predicting the Concreteness of German Words., and . SwissText/KONVENS, volume 2624 of CEUR Workshop Proceedings, CEUR-WS.org, (2020)Predicting Visible Terms from Image Captions using Concreteness and Distributional Semantics., and . KDIR, page 161-169. SCITEPRESS, (2022)POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems., , , , , , , , , and 5 other author(s). DATE, page 1456-1461. IEEE, (2020)Computer-aided diagnosis of acute ischemic stroke based on cerebral hypoperfusion using 4D CT angiography., , , , and . Medical Imaging: Computer-Aided Diagnosis, volume 8670 of SPIE Proceedings, page 867012. SPIE, (2013)