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Disambiguation of "Kim, Jonghoon J."

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Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

, , , , , , , , and . EMC Compo, page 158-162. IEEE, (2013)

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Heinrich J J Mieschendahl

Norbert J J Bock

J J M Ramakers

Ulrich J J Longerich

Ulrich J J Longerich

 

Other publications of authors with the same name

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC., , , , , , and . EMC Compo, page 248-251. IEEE, (2015)Fault detection and isolation of multiple defects in through silicon via (TSV) channel., , , , , , and . 3DIC, page 1-5. IEEE, (2014)Fault isolation of short defect in through silicon via (TSV) based 3D-IC., , , , , , , and . 3DIC, page 1-4. IEEE, (2013)Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation., , , , , , and . 3DIC, page TS8.29.1-TS8.29.4. IEEE, (2015)Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment., , , , and . EMC Compo, page 238-242. IEEE, (2013)Non-contact wafer-level TSV connectivity test methodology using magnetic coupling., , , , , , , , and . 3DIC, page 1-4. IEEE, (2013)Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs., , , , , , and . 3DIC, page 1-6. IEEE, (2014)Eye-diagram simulation and analysis of a high-speed TSV-based channel., , , , , , , and . 3DIC, page 1-7. IEEE, (2013)Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC., , , , , , , , , and 1 other author(s). 3DIC, page TS8.25.1-TS8.25.5. IEEE, (2015)Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling., , , , , , , , and . EMC Compo, page 158-162. IEEE, (2013)