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3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

, , , , , , , , , , , , и . 3DIC, стр. 1-5. IEEE, (2009)

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Wim Wätjen

Wim Lutzke

Wim Broekaert

Wim Beyers

Wim Damen

 

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