( en | de | ru )

 

Disambiguation of "Okamoto, Daisuke"

Author of the publication

copydeleteadd this publication to your clipboard
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers.

, , , , , , , , and . 3DIC, page 1-6. IEEE, (2019)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Hideakira Okamoto

Daisuke Yoshida

Daisuke Shibata

Daisuke Akimoto

Takashi Okamoto

 

Other publications of authors with the same name

Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers., , , , , , , , and . 3DIC, page 1-6. IEEE, (2019)Target Application Grouping Function Considering Software Updates on Application Execution Control System., , , and . COMPSAC Workshops, page 627-632. IEEE Computer Society, (2013)5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF., , , , , , , , , and 10 other author(s). OFC, page 1-3. IEEE, (2015)First demonstration of athermal silicon optical interposers with quantum dot lasers operating up to 125 °C., , , , , , , , , and 23 other author(s). ECOC, page 1-3. IEEE, (2014)Demonstration of 25-Gbps optical data links on silicon optical interposer using FPGA transceiver., , , , , , , , , and 23 other author(s). ECOC, page 1-3. IEEE, (2014)High Performance Si Photonics Devices and InP/EO Polymer Hybrid Optical Modulator for Data Communication and Computing., , , , , and . OECC/PSC, page 1-3. IEEE, (2022)