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A scalable synchronous reload technique for wide division range multi modulus dividers.

, , , , and . ICECS, page 555-558. IEEE, (2015)

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A 60 GHz wideband Variable Gain Amplifier in 130nm SiGe BiCMOS for dielectric spectroscopy., , , , and . NEWCAS, page 285-288. IEEE, (2017)A scalable synchronous reload technique for wide division range multi modulus dividers., , , , and . ICECS, page 555-558. IEEE, (2015)A 30 GHz Power Detector based Reflectometer in 130nm SiGe BiCMOS for Dielectric Spectroscopy., , , , , and . ISCAS, page 1-4. IEEE, (2018)Data Link Layer Processor for 100 Gbps Terahertz Wireless Communications in 28 nm CMOS Technology., , , , , , and . IEEE Access, (2019)A V-band Bidirectional Amplifier-Module for Hybrid Phased-Array Systems in BiCMOS Technology., , , and . RWS, page 330-333. IEEE, (2020)Modular Data Link Layer Processing for THz communication., , , , and . DDECS, page 1-5. IEEE, (2019)Wireless Communication Systems in the 240 GHz Band: Applications, Feasibility and Challenges., , , , , and . ISWCS, page 436-440. IEEE, (2019)A low-power 190-255 GHz frequency quadrupler in SiGe BiCMOS technology for on-chip spectroscopic applications., , , , , and . RWS, page 94-97. IEEE, (2017)Implementation of a Multi-Core Data Link Layer Processor for THz Communication., , , , , and . VTC Spring, page 1-5. IEEE, (2018)A Broadband 110-170 GHz Frequency Multiplier by 4 Chain with 8 dBm Output Power in 130 nm BiCMOS., , , and . ESSCIRC, page 451-454. IEEE, (2021)