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Harnessing process variations for optimizing wafer-level probe-test flow., , , , , and . ITC, page 1-8. IEEE, (2016)On Improving Hotspot Detection Through Synthetic Pattern-Based Database Enhancement., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 40 (12): 2522-2527 (2021)Automated Die Inking through On-line Machine Learning., , , , , and . IOLTS, page 27-32. IEEE, (2019)Subtle Anomaly Detection of Microscopic Probes using Deep learning based Image Completion., , , , , and . ITC, page 1-3. IEEE, (2019)Machine Learning-based Noise Classification and Decomposition in RF Transceivers., , , , , and . VTS, page 1-6. IEEE, (2019)Enhanced hotspot detection through synthetic pattern generation and design of experiments., , and . VTS, page 1-6. IEEE Computer Society, (2018)Machine Learning-Based Adaptive Outlier Detection for Underkill Reduction in Analog/RF IC Testing., , , , , and . VTS, page 1-7. IEEE, (2023)Automated Socket Anomaly Detection through Deep Learning., , , , , , , and . ITC, page 1-5. IEEE, (2020)Zero Trust Approach to IC Manufacturing and Testing., , , and . ITC, page 583-586. IEEE, (2022)Automated die inking: A pattern recognition-based approach., , , and . ITC, page 1-6. IEEE, (2017)