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Disambiguation of "Chen, Kuan-Neng"

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Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C.

, , and . 3DIC, page 1-4. IEEE, (2019)

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Kuan-Neng Chen

Kuan Chen

Kuan-yu Chen

Pei Kuang

Julia Neng

 

Other publications of authors with the same name

Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging., , , , , , , and . VLSI Technology and Circuits, page 387-388. IEEE, (2022)Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology., , and . 3DIC, page 1-4. IEEE, (2019)Low temperature (<180 °C) bonding for 3D integration., , , , , , , , , and 1 other author(s). 3DIC, page 1-5. IEEE, (2013)Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C., , and . 3DIC, page 1-4. IEEE, (2019)Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer., , , and . 3DIC, page 1-4. IEEE, (2019)An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology., , , , , , , , , and 5 other author(s). VLSI Technology and Circuits, page 262-263. IEEE, (2022)18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications., , , , , , , , , and 7 other author(s). ISSCC, page 320-321. IEEE, (2014)Area-power-efficient 11-bit SAR ADC with delay-line enhanced tuning for neural sensing applications., , , , , , , , , and . BioCAS, page 238-241. IEEE, (2013)An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer., , , , , , , , , and 7 other author(s). ISCAS, page 1-4. IEEE, (2017)Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias., , , , , , and . 3DIC, page 1-4. IEEE, (2019)