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High frequency signal transmission characteristics of cone bump interconnections.

, , and . 3DIC, page 1-5. IEEE, (2011)

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Effects of Electric Field on Metal-Induced Lateral Crystallization under Limited Ni-Supply Condition., , and . IEICE Trans. Electron., 88-C (4): 662-666 (2005)High frequency signal transmission characteristics of cone bump interconnections., , and . 3DIC, page 1-5. IEEE, (2011)Formation of Low Resistance Contacts to p-type 4H-SiC using Al-Film Source Laser Doping., , , , and . PHOTOPTICS, page 294-298. SciTePress, (2019)Foreword.. IEICE Trans. Electron., 92-C (5): 593 (2009)Room-temperature bonding mechanism of compliant bump with ultrasonic assist., and . 3DIC, page TS8.15.1-TS8.15.4. IEEE, (2015)Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration., , , and . 3DIC, page 1-4. IEEE, (2011)High-speed via hole filling using electrophoresis of Ag nanoparticles., , , , , , and . 3DIC, page TS5.4.1-TS5.4.4. IEEE, (2015)Foreword.. IEICE Trans. Electron., 93-C (10): 1489 (2010)Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding., , , and . 3DIC, page 1-4. IEEE, (2013)Effect of Subthreshold Slope on Sensitivity of MOS-HEMT Square Law Detector for THz Waves., , , , , , and . TENCON, page 1049-1052. IEEE, (2018)