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A single-photon-avalanche-diode 3D imager., , , , , and . ESSCIRC, page 487-490. IEEE, (2005)Characterization of chip-to-chip wireless interconnections based on capacitive coupling., , , , , , , and . VLSI-SoC, page 375-380. IEEE, (2010)System on chip with 1.12mW-32Gb/s AC-coupled 3D memory interface., , , , , , and . CICC, page 463-466. IEEE, (2009)3D capacitive transmission of analog signals with automatic compensation of the voltage attenuation., , , , , , , and . ESSCIRC, page 116-119. IEEE, (2009)Design of electro-optical demodulating pixel in CMOS technology., , , , , and . ISCAS (1), page 572-575. IEEE, (2005)3D system on chip memory interface based on modeled capacitive coupling interconnections., , , , , , , and . 3DIC, page 1-4. IEEE, (2010)Chip-to-chip communication based on capacitive coupling., , , , , , and . 3DIC, page 1-6. IEEE, (2009)Input/Output Pad for Direct Contact and Contactless Testing., , , , , , , , , and . ETS, page 135-140. IEEE Computer Society, (2011)