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3D system on chip memory interface based on modeled capacitive coupling interconnections., , , , , , , и . 3DIC, стр. 1-4. IEEE, (2010)Chip-to-chip communication based on capacitive coupling., , , , , , и . 3DIC, стр. 1-6. IEEE, (2009)From Heterogeneous Sensor Networks to Integrated Software Services: Design and Implementation of a Semantic Architecture for the Internet of Things at ARCES@UNIBO., , , , , , , , , и 6 other автор(ы). FRUCT, стр. 10-18. IEEE, (2018)RFI/Q Downconverter With Gain/Phase Calibration., , и . IEEE Trans. Circuits Syst. II Express Briefs, 54-II (4): 367-371 (2007)Input/Output Pad for Direct Contact and Contactless Testing., , , , , , , , , и . ETS, стр. 135-140. IEEE Computer Society, (2011)A photodiode cell for applications to position and motion estimation sensors., , , и . IEEE Trans. Ind. Electron., 43 (1): 200-206 (1996)A design flow for inductively degenerated LNAs., , и . ICECS, стр. 615-618. IEEE, (2004)Active electrode IC combining EEG, electrical impedance tomography, continuous contact impedance measurement and power supply on a single wire., , , и . ESSCIRC, стр. 335-338. IEEE, (2011)Quadrature VCO based on direct second harmonic locking., , , и . ISCAS (1), стр. 169-172. IEEE, (2004)Analog implementation of gamma-correction for CMOS cameras., , , , и . ICECS, стр. 419-422. IEEE, (1998)