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- 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), page 1-4. (June 2024)
- Proceedings of the 16th International Conference on Automotive User Interfaces and Interactive Vehicular Applications, page 136–148. New York, NY, USA, Association for Computing Machinery, (Sep 22, 2024)
- Proceedings of the 2024 ACM Designing Interactive Systems Conference, page 3063–3078. New York, NY, USA, Association for Computing Machinery, (Jul 1, 2024)
- Multimodal Technologies and Interaction, (2024)
- Proceedings of the CHI Conference on Human Factors in Computing Systems, page 1–17. New York, NY, USA, Association for Computing Machinery, (May 11, 2024)
- Proceedings of the 35th Annual ACM Symposium on User Interface Software and Technology, page 1–15. New York, NY, USA, Association for Computing Machinery, (Oct 28, 2022)
- IEEE Sensors Journal, (2024)
- 2023 IEEE SENSORS, page 01-04. (2023)
- 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), page 1-4. (July 2023)
- 2023 IEEE International Flexible Electronics Technology Conference (IFETC), page 1-3. IEEE, (August 2023)
- IEEE Sensors Letters, 7 (5): 1-4 (May 2023)
- Transportation Research Interdisciplinary Perspectives, (2023)
- 2022 IEEE Sensors, page 1-4. (October 2022)
- Multimodal Technologies and Interaction, 6 (10): 94 (October 2022)
- Extended Abstracts of the 2020 CHI Conference on Human Factors in Computing Systems, ACM, (April 2020)
- Proceedings of the Symposium on Spatial User Interaction, ACM, (October 2018)
- UIST'22 Adjunct: 35th ACM User Interface Software and Technology Symposium, Bend, Oregon, USA, Association for Computing Machinery, (October 2022)
- VRCAI '04: Proceedings of the 2004 ACM SIGGRAPH international conference on Virtual Reality continuum and its applications in industry, page 189--196. New York, NY, USA, ACM, (2004)event-place: Singapore.
- International Journal of Virtual Reality, 8 (2): 83--90 (2009)Publisher: IPI press.
- UIST'16: 29th ACM User Interface Software and Technology Symposium, page 335--346. Tokyo, Japan, ACM, (October 2016)
