( en | de | ru )

 

Disambiguation of "Tokei, Zsolt"

Author of the publication

copydeleteadd this publication to your clipboard
Global Is the New Local: FPGA Architecture at 5nm and Beyond.

, , , and . FPGA, page 34-44. ACM, (2021)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Zsolt Szücs

Zsolt Szabó

Zsolt Zrinyi

Zsolt Szabó

Zsolt Szentiványi

 

Other publications of authors with the same name

Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability., , , , and . Microelectron. Reliab., 45 (9-11): 1299-1304 (2005)A tool flow for predicting system level timing failures due to interconnect reliability degradation., , , , , and . ACM Great Lakes Symposium on VLSI, page 291-296. ACM, (2008)First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP., , , , , , , , , and 5 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2022)As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability., , , , , , , , , and 1 other author(s). Microelectron. Reliab., 54 (9-10): 1675-1679 (2014)Electromigration limits of copper nano-interconnects., , , and . IRPS, page 1-6. IEEE, (2021)Global Is the New Local: FPGA Architecture at 5nm and Beyond., , , and . FPGA, page 34-44. ACM, (2021)Metal reliability mechanisms in Ruthenium interconnects., , , , , , , , and . IRPS, page 1-7. IEEE, (2020)Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch., , , , and . IRPS, page 1-6. IEEE, (2019)Stress mitigation of 3D-stacking/packaging induced stresses., , , , , , , , and . IRPS, page 4. IEEE, (2018)Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps., , , , , , , , and . IRPS, page 1-6. IEEE, (2021)