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A compact fifth-order SIW BPF based on TSV technology with high selectivity., , , , , , , and . Microelectron. J., (February 2024)A transformer with high coupling coefficient and small area based on TSV., , , , and . Integr., (2021)Effects of coaxial through-silicon via on carrier mobility along 100 and 110 crystal directions of (100) silicon., , , , and . IEICE Electron. Express, 12 (14): 20150434 (2015)Electromagnetic modeling and analysis of the tapered differential through glass vias., , , , , , and . Microelectron. J., (2019)TSV-based hairpin bandpass filter for 6G mobile communication applications., , , , , and . IEICE Electron. Express, 18 (15): 20210247 (2021)Inductance of Different Profiles of Through Glass Vias based on magnetic flux density., , , , , , and . APCCAS, page 439-442. IEEE, (2018)A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application., , , , and . IEEE Trans. Very Large Scale Integr. Syst., 30 (7): 989-992 (2022)Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application., , and . Microelectron. J., (2022)Design of compact LC lowpass filters based on coaxial through-silicon vias array., , , , , , and . Microelectron. J., (2021)A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line., , , , and . IEICE Electron. Express, 19 (3): 20210515 (2022)