( en | de | ru )

 

Disambiguation of "Zheng, Li-Rong"

Author of the publication

copydeleteadd this publication to your clipboard
Evaluation of non-contact flexible electrodes connected with a customized IC-steps towards a fully integrated ECG sensor.

, , and . NORCHIP, page 1-5. IEEE, (2013)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Zheng Li

Zheng Li

Zheng Ren-Rong

Meng-Rong Li

Xian-Zheng Li

 

Other publications of authors with the same name

Case study of interconnect analysis for standing wave oscillator design., , , , and . ISCAS (1), page 456-459. IEEE, (2005)Effective power and ground distribution scheme for deep submicron high speed VLSI circuits., and . ISCAS (1), page 537-540. IEEE, (1999)Using IoT Technologies to Resolve the Food Safety Problem - An Analysis Based on Chinese Food Standards., , , and . WISM, volume 7529 of Lecture Notes in Computer Science, page 380-392. Springer, (2012)Data driven quantitative trust model for the Internet of Agricultural Things., , , and . IOT, page 31-36. IEEE, (2014)Low Complexity Burst Packet Detection for Wireless-Powered UWB RFID Systems., , , , and . ICUWB, page 1-5. IEEE, (2015)A wearable ECG monitoring device with flexible embedded denoising and compression., , , and . ESSCIRC, page 87-90. IEEE, (2016)Phase noise improvement and noise modeling of type-I ADPLL with non-linear quantization effects., , , , and . NORCHIP, page 1-4. IEEE, (2014)Analytical models for channel potential, threshold voltage, and subthreshold swing of junctionless triple-gate FinFETs., , , , , and . Microelectron. J., (2016)Interconnect intellectual property for Network-on-Chip (NoC)., , and . J. Syst. Archit., 50 (2-3): 65-79 (2004)A Wirelessly Powered UWB RFID Sensor Tag With Time-Domain Analog-to-Information Interface., , , , and . IEEE J. Solid State Circuits, 53 (8): 2227-2239 (2018)