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Oscillation-Based Prebond TSV Test.

, , , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 32 (9): 1440-1444 (2013)

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Stephen K Hashmi

Stephen K Hashmi

Stephen K Sherwood

Ibrahim Sünter

Sevinc Sünter

 

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Test Metrics for Analog Parametric Faults., и . VTS, стр. 226-235. IEEE Computer Society, (1999)Mid-bond Interposer Wire Test., , , , и . Asian Test Symposium, стр. 153-158. IEEE Computer Society, (2013)The P1149.4 Mixed Signal Test Bus: Costs and Benefits.. ITC, стр. 444-450. IEEE Computer Society, (1995)BIST vs. ATE: need a different vehicle?. ITC, стр. 1148. IEEE Computer Society, (1998)Innovative practices session 4C: Disruptive solutions in the non-digital world., , , , и . VTS, стр. 1. IEEE Computer Society, (2014)Noise-Insensitive Digital BIST for any PLL or DLL., и . J. Electron. Test., 24 (5): 461-472 (2008)Experiences with parametric BIST for production testing PLLs with picosecond precision., , и . ITC, стр. 410-418. IEEE Computer Society, (2010)IC Mixed-Signal BIST: Separating Facts from Fiction.. ITC, стр. 1205. IEEE Computer Society, (2002)Adaptive parametric BIST of high-speed parallel I/Os via standard boundary scan., и . ITC, стр. 1-9. IEEE Computer Society, (2011)A unified method for parametric fault characterization of post-bond TSVs., , , , и . ITC, стр. 1-10. IEEE Computer Society, (2012)