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25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV.
D. Lee, K. Kim, K. Kim, H. Kim, J. Kim, Y. Park, J. Kim, D. Kim, H. Park, J. Shin, J. Cho, K. Kwon, M. Kim, J. Lee, K. Park, B. Chung, und S. Hong.ISSCC, Seite 432-433. IEEE, (2014)
Metadaten
- BibTeX-Schlüssel
- conf/isscc/LeeKKKKPKKPSCKK14
- Eintragstyp
- inproceedings
- Buchtitel
- ISSCC
- Jahr
- 2014
- Seiten
- 432-433
- Verlag
- IEEE
- BibTeX-Querverweis
- conf/isscc/2014
- ee
- https://www.wikidata.org/entity/Q56535514
- isbn
- 978-1-4799-0918-6
- URL
- http://dblp.uni-trier.de/db/conf/isscc/isscc2014.html#LeeKKKKPKKPSCKK14
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%1 conf/isscc/LeeKKKKPKKPSCKK14
%A Lee, Dong-Uk
%A Kim, Kyung Whan
%A Kim, Kwan-Weon
%A Kim, Hongjung
%A Kim, Ju Young
%A Park, Young Jun
%A Kim, Jae Hwan
%A Kim, Dae Suk
%A Park, Heat Bit
%A Shin, Jin Wook
%A Cho, Jang Hwan
%A Kwon, Ki Hun
%A Kim, Min Jeong
%A Lee, Jaejin
%A Park, Kunwoo
%A Chung, Byong-Tae
%A Hong, Sung-Joo
%B ISSCC
%D 2014
%I IEEE
%K dblp
%P 432-433
%T 25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV.
%U http://dblp.uni-trier.de/db/conf/isscc/isscc2014.html#LeeKKKKPKKPSCKK14
%@ 978-1-4799-0918-6
@inproceedings{conf/isscc/LeeKKKKPKKPSCKK14,
added-at = {2020-10-11T00:00:00.000+0200},
author = {Lee, Dong-Uk and Kim, Kyung Whan and Kim, Kwan-Weon and Kim, Hongjung and Kim, Ju Young and Park, Young Jun and Kim, Jae Hwan and Kim, Dae Suk and Park, Heat Bit and Shin, Jin Wook and Cho, Jang Hwan and Kwon, Ki Hun and Kim, Min Jeong and Lee, Jaejin and Park, Kunwoo and Chung, Byong-Tae and Hong, Sung-Joo},
biburl = {https://www.bibsonomy.org/bibtex/2d663209ab2c3f9940e64b9d51e8f8367/dblp},
booktitle = {ISSCC},
crossref = {conf/isscc/2014},
ee = {https://www.wikidata.org/entity/Q56535514},
interhash = {4b7a0c459553cfc486695a1349b344af},
intrahash = {d663209ab2c3f9940e64b9d51e8f8367},
isbn = {978-1-4799-0918-6},
keywords = {dblp},
pages = {432-433},
publisher = {IEEE},
timestamp = {2024-04-09T20:42:55.000+0200},
title = {25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV.},
url = {http://dblp.uni-trier.de/db/conf/isscc/isscc2014.html#LeeKKKKPKKPSCKK14},
year = 2014
}