%0 Conference Paper %1 conf/irps/PaulKGS18 %A Paul, Milova %A Kumar, Boeila Sampath %A Gossner, Harald %A Shrivastava, Mayank %B IRPS %D 2018 %I IEEE %K dblp %P 3 %T Contact and junction engineering in bulk FinFET technology for improved ESD/latch-up performance with design trade-offs and its implications on hot carrier reliability. %U http://dblp.uni-trier.de/db/conf/irps/irps2018.html#PaulKGS18 %@ 978-1-5386-5479-8

@inproceedings{conf/irps/PaulKGS18, added-at = {2021-10-14T00:00:00.000+0200}, author = {Paul, Milova and Kumar, Boeila Sampath and Gossner, Harald and Shrivastava, Mayank}, biburl = {https://www.bibsonomy.org/bibtex/23dfd369898195d3d40ad4b3df515d7f1/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2018}, ee = {https://doi.org/10.1109/IRPS.2018.8353573}, interhash = {6aff49bb96cff41c930cc55c0da3c8c9}, intrahash = {3dfd369898195d3d40ad4b3df515d7f1}, isbn = {978-1-5386-5479-8}, keywords = {dblp}, pages = 3, publisher = {IEEE}, timestamp = {2024-04-10T16:54:56.000+0200}, title = {Contact and junction engineering in bulk FinFET technology for improved ESD/latch-up performance with design trade-offs and its implications on hot carrier reliability.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2018.html#PaulKGS18}, year = 2018 }