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Disambiguation of "Kim, Seongjong"

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1.74-µW/ch, 95.3%-accurate spike-sorting hardware based on Bayesian decision.

, , , , and . VLSI Circuits, page 1-2. IEEE, (2016)

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Ky ng Kim

Die Artikelstruktur in passiven zweisprachigen Wörterbüchern Deutsch-Koreanisch: Konzeption zur Erstellung eines zweisprachigen Lernerwörterbuchs Deutsch-Koreanisch. Uni Heidelberg, (2008)

Baeckpyeng Kim

Zaezeung Kim

Kison Kim

Wonchan Kim

 

Other publications of authors with the same name

Near-Vt adaptive microprocessor and power-management-unit system based on direct error regulation., , and . ESSCIRC, page 163-166. IEEE, (2017)Compact and voltage-scalable sensor for accurate thermal sensing in dynamic thermal management., , , , , , and . MWSCAS, page 33-36. IEEE, (2017)R-processor: 0.4V resilient processor with a voltage-scalable and low-overhead in-situ error detection and correction technique in 65nm CMOS., and . VLSIC, page 1-2. IEEE, (2014)Analysis and optimization of in-situ error detection techniques in ultra-low-voltage pipeline., and . ISLPED, page 291-294. ACM, (2014)25.9 Reconfigurable Transient Current-Mode Global Interconnect Circuits in 10nm CMOS for High-Performance Processors with Wide Voltage-Frequency Operating Range., , , , , , , , , and 4 other author(s). ISSCC, page 396-398. IEEE, (2020)A 30.1μm2, > ±1.1°C-3σ-error, 0.4-to-1.0V temperature sensor based on direct threshold-voltage sensing for on-chip dense thermal monitoring., and . CICC, page 1-4. IEEE, (2015)A 617 TOPS/W All Digital Binary Neural Network Accelerator in 10nm FinFET CMOS., , , , , , , , , and 1 other author(s). VLSI Circuits, page 1-2. IEEE, (2020)Optimized Fused Floating-Point Many-Term Dot-Product Hardware for Machine Learning Accelerators., , , , and . ARITH, page 84-87. IEEE, (2019)16.4 0.6-to-1.0V 279μm2, 0.92μW temperature sensor with less than +3.2/-3.4°C error for on-chip dense thermal monitoring., , , and . ISSCC, page 282-283. IEEE, (2014)A 1mW Always-on Computer Vision Deep Learning Neural Decision Processor., , , , , , , , , and 7 other author(s). ISSCC, page 158-159. IEEE, (2023)