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Revealing Ordered Polymer Packing during Freeze-Drying Fabrication of a Bulk Heterojunction Poly(3-hexylthiophene-2,5-diyl):6,6-Phenyl-C61-butyric Acid Methyl Ester Layer: In Situ Optical Spectroscopy, Molecular Dynamics Simulation, and X-ray Diffraction

Y. Lan, P. Sher, C. Lee, C. Pao, C. Tsao, Y. Huang, P. Huang, C. Wu, and J. Wang. The Journal of Physical Chemistry C, 121 (27): 14826--14834 (June 2017)
DOI: 10.1021/acs.jpcc.7b01679

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Ping-I Chih

Chih-I Lin

Chih-kuang Wu

Chih-Wu Kuo

Matei Chihaia

Other publications of authors with the same name

Write-energy-saving ReRAM-based nonvolatile SRAM with redundant bit-write-aware controller for last-level caches.T. Chien, L. Chiou, Y. Tsou, S. Sheu, P. Wang, M. Tsai, and C. Wu. ISLPED, page 1-6. IEEE, (2017)Low-Power MCU With Embedded ReRAM Buffers as Sensor Hub for IoT Applications.T. Chien, L. Chiou, S. Sheu, J. Lin, C. Lee, T. Ku, M. Tsai, and C. Wu. IEEE J. Emerg. Sel. Topics Circuits Syst., 6 (2): 247-257 (2016)A low store energy and robust ReRAM-based flip-flop for normally off microprocessors.T. Chien, L. Chiou, Y. Chuang, S. Sheu, H. Li, P. Wang, T. Ku, M. Tsai, and C. Wu. ISCAS, page 2803-2806. IEEE, (2016)An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology.J. Zhang, W. Lu, P. Huang, S. Li, T. Hung, S. Wu, M. Dai, I. Chung, W. Chen, C. Wang and 5 other author(s). VLSI Technology and Circuits, page 262-263. IEEE, (2022)An 8b-Precision 6T SRAM Computing-in-Memory Macro Using Time-Domain Incremental Accumulation for AI Edge Chips.P. Wu, J. Su, Y. Chung, L. Hong, J. Ren, F. Chang, Y. Wu, H. Chen, C. Lin, H. Hsiao and 10 other author(s). IEEE J. Solid State Circuits, 59 (7): 2297-2309 (July 2024)A 4-Kb 1-to-8-bit Configurable 6T SRAM-Based Computation-in-Memory Unit-Macro for CNN-Based AI Edge Processors.Y. Chiu, Z. Zhang, J. Chen, X. Si, R. Liu, Y. Tu, J. Su, W. Huang, J. Wang, W. Wei and 8 other author(s). IEEE J. Solid State Circuits, 55 (10): 2790-2801 (2020)Wafer-Scale Bi-Assisted Semi-Auto Dry Transfer and Fabrication of High-Performance Monolayer CVD WS2 Transistor.M. Li, C. Hsu, S. Shen, A. Chou, Y. Lin, C. Chuu, N. Yang, S. Chou, L. Huang, C. Cheng and 7 other author(s). VLSI Technology and Circuits, page 290-291. IEEE, (2022)A 48 TOPS and 20943 TOPS/W 512kb Computation-in-SRAM Macro for Highly Reconfigurable Ternary CNN Acceleration.C. Lin, F. Tsai, J. Su, S. Li, T. Chang, S. Sheu, W. Lo, S. Chang, C. Wu, and T. Hou. A-SSCC, page 1-3. IEEE, (2021)Memory access algorithm for low energy CPU/GPU heterogeneous systems with hybrid DRAM/NVM memory architecture.T. Chien, L. Chiou, C. Cheng, S. Sheu, P. Wang, M. Tsai, and C. Wu. APCCAS, page 461-464. IEEE, (2016)Revealing Ordered Polymer Packing during Freeze-Drying Fabrication of a Bulk Heterojunction Poly(3-hexylthiophene-2,5-diyl):6,6-Phenyl-C61-butyric Acid Methyl Ester Layer: In Situ Optical Spectroscopy, Molecular Dynamics Simulation, and X-ray DiffractionY. Lan, P. Sher, C. Lee, C. Pao, C. Tsao, Y. Huang, P. Huang, C. Wu, and J. Wang. The Journal of Physical Chemistry C, 121 (27): 14826--14834 (June 2017)

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Disambiguation of "Wu, Chih-I"