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Design, CAD and technology challenges for future processors: 3D perspectives., , , , , and . DAC, page 212. ACM, (2011)Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module., , , , , , , , , and 15 other author(s). IEEE J. Solid State Circuits, 49 (1): 9-18 (2014)Design-synthesis co-optimisation using skewed and tapered gates., , , , , , and . DATE, page 1144-1147. IEEE, (2016)4.1 22nm Next-generation IBM System z microprocessor., , , , , , , , , and 21 other author(s). ISSCC, page 1-3. IEEE, (2015)POWER7TM local clocking and clocked storage elements., , , , , , , and . ISSCC, page 178-179. IEEE, (2010)Circuit and PD challenges at the 14nm technology node.. ISPD, page 66-67. ACM, (2013)CMOS scaling in the 0.1-µm, 1.X-volt regime for high-performance applications., , , , , , , , , and 4 other author(s). IBM J. Res. Dev., 39 (1-2): 229-244 (1995)IBM z13 circuit design and methodology., , , , , , , , , and 22 other author(s). IBM J. Res. Dev., (2015)Impact of Device Aging on Early Mode Failures in Pulsed Latches., , and . VLSID, page 256-260. IEEE Computer Society, (2018)An elegant hardware-corroborated statistical repair and test methodology for conquering aging effects., , , , and . ICCAD, page 497-504. ACM, (2009)