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The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications.

, , , , , , , and . ICST, page 1-6. IEEE, (2017)

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Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology., , , , and . ECOC, page 1-3. IEEE, (2014)Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor., , , , , , and . IEEE SENSORS, page 1-4. IEEE, (2021)From fan-out wafer to fan-out panel level packaging., , , , , , , , , and . ECCTD, page 1-4. IEEE, (2015)Development of Rechargeable Micro Batteries Based on Micro Channel Structures., , , , , , and . GreenCom, page 619-623. IEEE Computer Society, (2012)Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method., , , , , , , and . DeSE, page 939-942. IEEE, (2019)Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies., , , , , , , and . DeSE, page 902-905. IEEE, (2019)Optimization Parameters for Laser-induced Forward Transfer of Al and Cu on Si-wafer Substrate., , , and . PHOTOPTICS, page 228-231. SCITEPRESS, (2018)Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars., , , , , and . Microelectron. Reliab., (2016)Improving the FE simulation of molded packages using warpage measurements., , , , , and . Microelectron. Reliab., 54 (9-10): 1862-1866 (2014)A WSi-WSiN-Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems., , , , , and . Micromachines, 7 (10): 193 (2016)