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Evaluation of Low-Voltage SRAM for Error-Resilient Augmented Reality Applications., , , и . SiPS, стр. 1-3. IEEE, (2021)3D nanosystems enable embedded abundant-data computing: special session paper., , , , , , , и . CODES+ISSS, стр. 29:1-29:2. ACM, (2017)Monolithic 3D integration: a path from concept to reality., , , , , и . DATE, стр. 1197-1202. ACM, (2015)A QDI Interconnect for 3D Systems Using Industry Standard EDA and Cell Libraries., , , , и . ASYNC, стр. 58-59. IEEE, (2023)Nano-engineered architectures for ultra-low power wireless body sensor nodes., , , , , , и . CODES+ISSS, стр. 23:1-23:10. ACM, (2016)Co-Optimization of SRAM Circuits with Sequential Access Patterns in a 7nm SoC Achieving 58% Memory Energy Reduction for AR Applications., , , , , , , и . VLSI Technology and Circuits, стр. 216-217. IEEE, (2022)11.2 A 3D integrated Prototype System-on-Chip for Augmented Reality Applications Using Face-to-Face Wafer Bonded 7nm Logic at <2μm Pitch with up to 40% Energy Reduction at Iso-Area Footprint., , , , , , , , , и 3 other автор(ы). ISSCC, стр. 210-212. IEEE, (2024)A Uniform Latency Model for DNN Accelerators with Diverse Architectures and Dataflows., , , , , и . DATE, стр. 220-225. IEEE, (2022)Hyperdimensional Computing Nanosystem., , , , , , и . CoRR, (2018)System-Level Design and Integration of a Prototype AR/VR Hardware Featuring a Custom Low-Power DNN Accelerator Chip in 7nm Technology for Codec Avatars., , , , , , , , , и 2 other автор(ы). CICC, стр. 1-8. IEEE, (2022)