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Tradeoffs in imager design parameters for sensor reliability.

, , , , and . Sensors, Cameras, and Systems for Industrial, Scientific, and Consumer Applications, volume 7875 of SPIE Proceedings, page 78750I. SPIE, (2011)

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Statistical identification and analysis of defect development in digital imagers., , , and . Digital Photography, volume 7250 of SPIE Proceedings, page 72500. SPIE, (2009)Fault Tolerance for Islandable-Microgrid Sensors., and . DFT, page 1-4. IEEE, (2021)Correcting high-density hot pixel defects in digital imagers., , , and . IMSE, volume 9022 of SPIE Proceedings, page 90220G. SPIE, (2014)Hot Pixel Behavior as Pixel Size Reduces to 1 micron., , , and . IMSE, page 39-45. Society for Imaging Science and Technology, (2017)Empirical formula for rates of hot pixel defects based on pixel size, sensor area, and ISO., , , and . Sensors, Cameras, and Systems for Industrial and Scientific Applications, volume 8659 of SPIE Proceedings, page 86590C. SPIE, (2013)Advanced Fault-Tolerance Techniques for a Color Digital Camera-on-a-Chip., , and . DFT, page 3-10. IEEE Computer Society, (2001)Experimental study and analysis of soft and permanent errors in digital cameras., , , , and . DFT, page 11-14. IEEE Computer Society, (2016)Laser Processes for Defect Correction in Large Area VLSI Systems.. DFT, page 106-114. IEEE Computer Society, (1994)Laser Correcting Defects to Create Transparent Routing for Large Area FPGA's., and . FPGA, page 17-23. ACM, (1997)Post arrays for the immobilization of vapochromic coordination polymers for chemical sensors., , , , and . IEEE SENSORS, page 1-3. IEEE, (2017)