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Tradeoffs in imager design parameters for sensor reliability.

, , , , and . Sensors, Cameras, and Systems for Industrial, Scientific, and Consumer Applications, volume 7875 of SPIE Proceedings, page 78750I. SPIE, (2011)

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Does the Floorplan of a Chip Affect Its Yield?, and . DFT, page 159-166. IEEE Computer Society, (1993)Tradeoffs in imager design parameters for sensor reliability., , , , and . Sensors, Cameras, and Systems for Industrial, Scientific, and Consumer Applications, volume 7875 of SPIE Proceedings, page 78750I. SPIE, (2011)Dependence of SEUs in Digital Cameras on Pixel size and Elevation., , , , and . DFT, page 1-4. IEEE, (2021)Do more camera pixels result in a better picture?, , and . IOLTS, page 73-78. IEEE Computer Society, (2012)On-Line Mapping of In-Field Defects in Image Sensor Arrays., , , , , and . DFT, page 439-447. IEEE Computer Society, (2006)Improved correction for hot pixels in digital imagers., , , , and . DFT, page 116-121. IEEE Computer Society, (2014)Measuring the Vulnerability of Interconnection Networks in Embedded Systems., , , and . IPPS/SPDP Workshops, volume 1388 of Lecture Notes in Computer Science, page 919-924. Springer, (1998)On the Bandwidth of a Multi-Stage Network in the Presence of Faulty Components., and . ICDCS, page 26-32. IEEE Computer Society, (1988)Statistical identification and analysis of defect development in digital imagers., , , and . Digital Photography, volume 7250 of SPIE Proceedings, page 72500. SPIE, (2009)A statistical study of defect maps of large area VLSI IC's., , and . IEEE Trans. Very Large Scale Integr. Syst., 2 (2): 249-256 (1994)